Transformable silicone epoxy resin-based adhesive "Bond E-Flex"
Cures at room temperature without mixing! Adheres well to various substrates such as stone and tiles.
"Bond Eflex" is a one-component modified silicone epoxy resin adhesive that cures at room temperature. It demonstrates excellent adhesive strength to various substrates and has low-temperature characteristics that exhibit outstanding rubber elasticity even at -30°C. Additionally, it requires no measuring or mixing, and there are no constraints on usable time, making it extremely user-friendly. This groundbreaking product leverages the excellent performance of epoxy resin while incorporating flexibility. 【Features】 ■ Cures at room temperature as a one-component product with no mixing required ■ Shows over 200% elongation at room temperature, absorbing external stress ■ Exhibits rubber elasticity over a wide range from -30°C to 80°C ■ Adheres well to various substrates (stone, tile, metal, concrete, etc.) ■ Minimal contamination to stone materials *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジェイ・シー・サプライ
- Price：Other
